![]() CFD tools enable a mechanical or electrical engineer and/or IC designer to quickly see the effect of design changes from a thermal management perspective both qualitatively and quantitatively. When IC packages are downsized, thermal power density increases, and the heat-transfer path from the die to the external ambient needs to be optimized to allow for maximum possible power dissipation at the die while still ensuring the die temperature is under the maximum allowable value.Īlthough PSOP undergo tests for reliability under temperature stresses, electrical flow, and solderability, as well as mechanical inspection at the manufacturer before shipping, it would be time-consuming and expensive to physically test or design test boards to test a package in all its possible applications and configurations.Ĭomputational fluid dynamics (CFD) software is useful in such situations because it can simulate and estimate the junction temperature (T j) of the IC when attached to the PCB under various conditions, including different powering conditions, board conductivity, thermal via distribution, bill of materials, and the IC package construction itself. Compared to older versions, the packages can be placed much closer to each other and to other components on the board. The open sides of the package can be used to route traces under the component, conserving board layers and simplifying board layout. The PSOP leads are located on the long side of the package, which leaves two sides of the package open. The mechanical dimensions of the power SOP (PSOP) package, combined with a heat spreading thermal mass (copper slug), make it a good choice for office automation, industrial controls, networking, and consumer applications that generate internal heat and are exposed to stressful temperature conditions. SOP components are a logical choice for the small form factor of handheld instruments, portable communication devices, laptop and notebook PCs, disk drives, and numerous other applications. SOP packages support the trend toward miniaturization by consuming one-third to one-half the volume of earlier packaging alternatives. Today’s integrated circuit (IC) package technology must deliver higher lead counts, reduced lead pitch, minimum footprint area, and significant volume reduction, which has led to semiconductor manufacturers developing the small outline package (SOP), surface-mount memory packaging. Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.Throughout the electronics industry, submicron feature size at the die level are driving package component sizes down to the design-rule level of the early technologies. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. You’ll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. ![]() Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan. The base pay range for this role is between $131,500 and $243,300, and your base pay will depend on your skills, qualifications, experience, and location.Īpple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs. This provides the opportunity to progress as you grow and develop within a role. ![]() At Apple, base pay is one part of our total compensation package and is determined within a range. ![]()
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